Chia-Hui Lin

City:

Country:

United States

Published Applications:

Last publication date:

2008-05-29

Top Assignees for applications by Chia-Hui Lin

The entities that hold a legal rights for patent applications filed by inventor Lin Chia-Hui:

Chia-Hui Lin from , US has applied for patents for these inventions. The list has both pending applications and granted patents:

POLY SILICON HARD MASK

Surface treated low-k dielectric as diffusion barrier for copper metallization

InventorID:

4181271 ⎘