Barry W. Eppler

City:

Berthoud, Colorado

Country:

United States

Published Applications:

Last publication date:

2008-06-12

Top Assignees for applications by Barry W. Eppler

The entities that hold a legal rights for patent applications filed by inventor Eppler Barry W.:

Barry W. Eppler from Berthoud, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Interconnect assemblies, and methods of forming interconnects

Interconnect assemblies, and methods of forming interconnects, between conductive contact bumps and conductive contact pads

InventorID:

4191759 ⎘