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Inventor profile of:

Chieh Chang

City:

Hsinchu

Country:

Taiwan

Published Applications:

7

Last publication date:

2026-05-21

Top Assignees for applications by Chieh Chang

The entities that hold a legal rights for patent applications filed by inventor Chang Chieh:

  • TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. 4 Hsinchu, Taiwan
  • F3 INC. 1 Hsinchu, Taiwan

Recent patent applications by Chang Chieh

Chieh Chang from Hsinchu, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-05-21
US20260144022A1
Electricity

BONDING SYSTEM WITH SEALING GASKET AND METHOD FOR USING THE SAME

#2 | 2025-06-12
US20250191968A1
Electricity

BONDING SYSTEM WITH SEALING GASKET AND METHOD FOR USING THE SAME

#3 | 2024-11-21
US20240387232A1
Electricity

BONDING SYSTEM AND METHOD FOR USING THE SAME

#4 | 2022-11-17
US20220367249A1
Electricity

Bonding system with sealing gasket and method for using the same

#5 | 2022-11-17
US20220367215A1
Electricity

Method and system for bonding

#6 | 2022-10-27
US20220344197A1
Electricity

BONDING SYSTEM AND METHOD FOR USING THE SAME

#7 | 2008-06-19
US20080144799A1
Electricity

Module and Method for Automatically Detecting and Switching between FXO and FXS Interfaces via Single RJ11

InventorID:

4197864 ⎘

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