David V. Reed

City:

Blanchester, Ohio

Country:

United States

Published Applications:

Last publication date:

2008-06-19

Top Assignees for applications by David V. Reed

The entities that hold a legal rights for patent applications filed by inventor Reed David V.:

David V. Reed from Blanchester, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Enhanced adhesion of polyethylene terephthalate to paperboard

Enhanced adhesion of polyethylene terephthalate to paperboard

Paperboard material with expanded polymeric microspheres

Enhanced adhesion of polyethylene terephthalate to paperboard

Paperboard substrate for blister packaging

InventorID:

4198532 ⎘