William Vander Weyst

City:

Gilbert, Arizona

Country:

United States

Published Applications:

Last publication date:

2008-06-26

Recent patent applications by Weyst William Vander

William Vander Weyst from Gilbert, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2008-06-26

US20080150132A1

Electricity

STACK UP PCB SUBSTRATE FOR HIGH DENSITY INTERCONNECT PACKAGES

InventorID:

4201804 ⎘