Boise, Idaho
United States
5
2008-06-26
The entities that hold a legal rights for patent applications filed by inventor Murphy Tim E.:
Tim E. Murphy from Boise, US has applied for patents for these inventions. The list has both pending applications and granted patents:
SEMICONDUCTOR DICE HAVING BACK SIDE REDISTRIBUTION LAYER ACCESSED USING THROUGH-SILICON VIAS, METHODS
#2 | 2007-01-25Stress and force management techniques for a semiconductor die
#3 | 2005-11-08Methods of fabrication of semiconductor dice having back side redistribution layer accessed using through-silicon vias and assemblies thereof
#4 | 2005-09-22Stress and force management techniques for a semiconductor die
#5 | 2005-08-25Semiconductor dice having back side redistribution layer accessed using through-silicon vias, methods
4203806 ⎘