Gyeonggi-do
South Korea
46
2026-05-21
The entities that hold a legal rights for patent applications filed by inventor Ahn Bum Mo:
Bum Mo Ahn from Gyeonggi-do, KR has applied for patents for these inventions. The list has both pending applications and granted patents:
METAL MOLDED PRODUCT
#2 | 2026-03-26ELECTRICALLY CONDUCTIVE CONTACT PIN
#3 | 2026-02-26ELECTRICALLY CONDUCTIVE CONTACT PIN
#4 | 2026-01-08ELECTRICALLY CONDUCTIVE CONTACT PIN AND METHOD FOR MANUFACTURING SAME
#5 | 2025-10-02ELECTRO-CONDUCTIVE CONTACT PIN AND INSPECTION DEVICE INCLUDING SAME
#6 | 2025-10-02ELECTRICAL CONNECTOR AND TEST DEVICE COMPRISING THE SAME
#7 | 2025-06-19METAL MOLDED ARTICLE, MANUFACTURING METHOD THEREFOR, AND INSPECTION DEVICE HAVING SAME
#8 | 2025-06-12ANODIZED FILM STRUCTURE AND INSPECTION DEVICE COMPRISING SAME
#9 | 2025-06-05ELECTRO-CONDUCTIVE CONTACT PIN AND VERTICAL PROBE CARD HAVING SAME
#10 | 2025-05-22INDUCTOR AND MANUFACTURING METHOD THEREFOR
#11 | 2025-02-06CONTACT PIN ASSEMBLY FOR KELVIN TEST AND KELVIN TEST DEVICE COMPRISING SAME
#12 | 2025-01-30ELECTRICALLY CONDUCTIVE CONTACT PIN AND INSPECTION DEVICE HAVING SAME
#13 | 2025-01-16ELECTRO-CONDUCTIVE CONTACT PIN, MANUFACTURING METHOD THEREFOR, AND ELECTRO-CONDUCTIVE CONTACT PIN MODULE
#14 | 2025-01-16GUIDE MEMBER, INSPECTION DEVICE, AND ELECTRO-CONDUCTIVE CONTACT PIN
#15 | 2025-01-09ANODIC OXIDATION FILM STRUCTURE
#16 | 2024-12-26METAL PRODUCT, METHOD OF MANUFACTURING SAME, AND TEST DEVICE HAVING SAME
#17 | 2024-12-26VERTICAL PROBE CARD
#18 | 2024-08-22ELECTRICALLY CONDUCTIVE CONTACT PIN
#19 | 2024-08-15MICRO BUMP, INTERPOSER FOR ELECTRICAL CONNECTION HAVING SAME, SEMICONDUCTOR PACKAGE, MULTI-LAYER STACKED SEMICONDUCTOR DEVICE, AND DISPLAY
#20 | 2024-07-11ANODIZED FILM STRUCTURE
#21 | 2024-07-11COMPOSITE MOLD, METAL MOLDED ARTICLE, AND METHOD FOR MANUFACTURING SAME
#22 | 2024-07-04VERTICALLY STACKED ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING SAME
#23 | 2024-07-04METAL STRUCTURE AND METHOD FOR MANUFACTURING SAME
#24 | 2024-06-13ELECTRICALLY CONDUCTIVE CONTACT PIN AND MANUFACTURING METHOD THEREFOR
#25 | 2024-06-06MEMBRANE-ELECTRODE ASSEMBLY, AND FUEL CELL INCLUDING SAME
#26 | 2024-06-06METAL PART AND PROCESS CHAMBER HAVING THE SAME
#27 | 2024-06-06ELECTRICALLY CONDUCTIVE CONTACT PIN AND MANUFACTURING METHOD THEREFOR
#28 | 2024-05-16ELECTRICALLY CONDUCTIVE CONTACT PIN
#29 | 2024-04-25COMPOSITE MOLD, METAL MOLDED ARTICLE, AND METHOD FOR MANUFACTURING SAME
#30 | 2024-04-11GUIDE PLATE AND TEST DEVICE INCLUDING SAME
#31 | 2024-04-11TEST DEVICE CAPABLE OF TESTING MICRO LED AND MANUFACTURING METHOD THEREOF
#32 | 2024-04-04ANODIC ALUMINUM OXIDE FILM-BASED INTERPOSER FOR ELECTRICAL CONNECTION AND MANUFACTURING METHOD THEREFOR, SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR, MULTI-STACKED SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR, DISPLAY AND MANUFACTURING METHOD THEREFOR
#33 | 2024-03-21ELECTRICALLY CONDUCTIVE CONTACT PIN
#34 | 2024-02-15INDUCTOR AND BODY PART FOR INDUCTOR
#35 | 2024-02-01MICRO DEVICE, MICRO DEVICE ALIGNMENT APPARATUS, AND ALIGNMENT METHOD USING SAME
#36 | 2023-11-30ELECTRICALLY CONDUCTIVE CONTACT PIN, INSPECTION APPARATUS, AND MOLDED PRODUCT
#37 | 2023-09-14ANODIZED FILM SUBSTRATE BASE, ANODIZED FILM SUBSTRATE PART HAVING SAME, ANODIZED FILM-BASED INTERPOSER HAVING SAME, AND SEMICONDUCTOR PACKAGE HAVING SAME
#38 | 2023-05-25Probe card
#39 | 2023-05-18Probe head and probe card comprising same
#40 | 2023-05-11Probe head and probe card having same
#41 | 2023-01-12METHOD FOR MANUFACTURING MICRO LED DISPLAY
#42 | 2022-12-29PART HAVING CORROSION-RESISTANT LAYER, MANUFACTURING PROCESS APPARATUS HAVING SAME, AND METHOD OF MANUFACTURING PART
#43 | 2022-07-14METHOD FOR MANUFACTURING MICRO LED DISPLAY, AND MICRO LED DISPLAY USING SAME
#44 | 2022-04-21MICRO LED SUCTION BODY, AND METHOD OF MANUFACTURING MICRO LED DISPLAY USING SAME
#45 | 2022-03-10PART WITH CORROSION-RESISTANT LAYER
#46 | 2008-07-17Method and Apparatus For Fabricating Polycrystalline Silicon Film Using Transparent Substrate
4215227 ⎘