Hiroshi KAI

City:

Aichi

Country:

Japan

Published Applications:

Last publication date:

2008-07-31

Top Assignees for applications by Hiroshi KAI

The entities that hold a legal rights for patent applications filed by inventor KAI Hiroshi:

Hiroshi KAI from Aichi, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

SOLDER JOINT STRUCTURE, SOLDERING METHOD, AND ELECTRONIC-COMPONENT MANUFACTURING APPARATUS USING THE SAME STRUCTURE AND THE METHOD

Solder joint structure, soldering method, and electronic-component manufacturing apparatus using the same structure and the method

InventorID:

4222247 ⎘