Keith C. STEVENS

City:

Fairfield, Vermont

Country:

United States

Published Applications:

Last publication date:

2015-12-17

Top Assignees for applications by Keith C. STEVENS

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Keith C. STEVENS from Fairfield, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Signal monitoring of through-wafer vias using a multi-layer inductor

Signal monitoring of through-wafer vias using a multi-layer inductor

Low-voltage IC test for defect screening

Methodologies and test configurations for testing thermal interface materials

Methodologies and test configurations for testing thermal interface materials

InventorID:

422250 ⎘