Dresden
Germany
6
2008-08-28
The entities that hold a legal rights for patent applications filed by inventor Friedemann Michael:
Michael Friedemann from Dresden, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
METHOD OF FORMING A COPPER-BASED METALLIZATION LAYER INCLUDING A CONDUCTIVE CAP LAYER BY AN ADVANCED INTEGRATION REGIME
#2 | 2008-07-31Method of forming a copper-based metallization layer including a conductive cap layer by an advanced integration regime
#3 | 2006-01-10Method of forming a conductive barrier layer having improved coverage within critical openings
#4 | 2005-10-20Method of forming a conductive barrier layer within critical openings by a final deposition step after a re-sputter deposition
#5 | 2005-05-05Barrier layer including a titanium nitride liner for a copper metallization layer including a low-k dielectric
#6 | 2005-01-11Method of forming a conductive barrier layer having improve adhesion and resistivity characteristics
4224096 ⎘