Esopus, New York
United States
15
2025-03-13
The entities that hold a legal rights for patent applications filed by inventor Bunt Jay A.:
Jay A. Bunt from Esopus, US has applied for patents for these inventions. The list has both pending applications and granted patents:
GENERATION OF RANDOM SECURITY CIRCUIT PATTERNS FOR IN-SITU FABRICATION OF TAMPER-RESPONDENT SENSORS
#2 | 2023-11-30Filter device having multiple changeable filter surfaces
#3 | 2022-11-03Coolant-cooled heat sink(s) with associated ultra-violet light assembly
#4 | 2022-06-16Tamper-respondent assemblies with porous heat transfer element(s)
#5 | 2022-05-19High power device fault localization via die surface contouring
#6 | 2021-11-30Tamper-respondent assembly with structural material within sealed inner compartment
#7 | 2021-08-12Conformal integrated circuit (IC) device package lid
#8 | 2021-07-29Lid/heat spreader having targeted flexibility
#9 | 2021-07-22Coolant-cooled heat sinks with internal thermally-conductive fins joined to the cover
#10 | 2021-04-29Non-destructive bond line thickness measurement of thermal interface material on silicon packages
#11 | 2020-11-17Fabricating coolant-cooled heat sinks with internal thermally-conductive fins
#12 | 2008-08-14Apparatus for providing uniaxial load distribution for laminate layers of multilayer ceramic chip carriers
#13 | 2008-08-14Apparatus for providing uniaxial load distribution for laminate layers of multilayer ceramic chip carriers
#14 | 2008-08-14Method for providing uniaxial load distribution for laminate layers of multilayer ceramic chip carriers
#15 | 2007-05-24METHOD AND APPARATUS FOR PROVIDING UNIAXIAL LOAD DISTRIBUTION FOR LAMINATE LAYERS OF MULTILAYER CERAMIC CHIP CARRIERS
4229822 ⎘