🔗 Permalink

Inventor profile of:

Doo Young KIM

City:

Suwon

Country:

South Korea

Published Applications:

39

Last publication date:

2016-03-31

Top Assignees for applications by Doo Young KIM

The entities that hold a legal rights for patent applications filed by inventor KIM Doo Young:

SAMSUNG ELECTRO-MECHANICS CO., LTD. 30 Suwon, South Korea
SAMSUNG ELECTRO-MECHANICS CO., LTD. 12 Suwon Gyunggi-do, South Korea
SAMSUNG ELECTRO-MECHANICS CO., LTD. 10 Suwon-si, Gyeonggi-do, South Korea
SAMSUNG ELECTRO-MECHANICS CO., LTD. 3 Gyunggi-do, South Korea
RESEARCH BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY 1 Suwon-si, Gyeonggi-do, South Korea
RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY 1 Suwon, Gyunggi-Do, South Korea
SAMSUNG ELECTRO-MECHANICS CO., LTD. 1 Suwon-si, South Korea
SAMSUNG ELECTRO-MECHANICS CO., LTD. 1 Gyeonggi-do, South Korea
Research & Business Foundation Sungkyunkwan University 1 Suwon, South Korea

Recent patent applications by KIM Doo Young

Doo Young KIM from Suwon, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2016-03-31

US20160090325A1

Chemistry; metallurgy

Dielectric ceramic composition and multilayer ceramic capacitor using the same

#2 | 2015-04-09

US20150098166A1

Chemistry; metallurgy

DIELECTRIC COMPOSITION AND MULTILATER CERAMIC ELECTRONIC COMPONENT MANUFACTURED USING THE SAME

#3 | 2015-03-26

US20150085422A1

Multilayer ceramic capacitor and method of manufacturing the same

#4 | 2015-03-19

US20150075853A1

MULTILAYER CERAMIC ELECTRONIC COMPONENT EMBEDDED IN BOARD AND PRINTED CIRCUIT BOARD HAVING THE SAME

#5 | 2015-03-05

US20150062774A1

Dielectric ceramic composition and multilayer ceramic capacitor including the same

#6 | 2015-03-05

US20150060121A1

Multilayer ceramic electronic part to be embedded in board and printed circuit board having multilayer ceramic electronic part embedded therein

#7 | 2015-02-26

US20150053471A1

Multilayer ceramic electronic part to be embedded in board and printed circuit board having multilayer ceramic electronic part embedded therein

#8 | 2015-02-12

US20150041198A1

Multilayer ceramic electronic part to be embedded in board and printed circuit board having multilayer ceramic electronic part embedded therein

#9 | 2015-02-12

US20150041193A1

Multilayer ceramic capacitor and board having the same mounted thereon

#10 | 2015-01-29

US20150029637A1

Dielectric composition for low-temperature sintering, multilayer ceramic electronic component including the same, and method of manufacturing multilayer ceramic electronic component

#11 | 2015-01-29

US20150027765A1

NICKEL POWDER FOR INTERNAL ELECTRODES, MULTILAYER CERAMIC CAPACITOR INCLUDING THE SAME, AND CIRCUIT BOARD HAVING ELECTRONIC COMPONENT MOUNTED THEREON

#12 | 2015-01-22

US20150021080A1

Multilayer ceramic electronic part to be embedded in board and printed circuit board having multilayer ceramic electronic part embedded therein

#13 | 2015-01-22

US20150021079A1

MULTILAYER CERAMIC ELECTRONIC COMPONENT TO BE EMBEDDED IN BOARD AND PRINTED CIRCUIT BOARD HAVING MULTILAYER CERAMIC ELECTRONIC COMPONENT EMBEDDED THEREIN

#14 | 2015-01-22

US20150021078A1

Multilayer ceramic electronic component to be embedded in board and printed circuit board having multilayer ceramic electronic component embedded therein

#15 | 2015-01-15

US20150014037A1

MULTILAYER CERAMIC CAPACITOR AND BOARD FOR MOUNTING THE SAME

#16 | 2014-12-11

US20140360764A1

Multilayer ceramic capacitor and board for mounting the same

#17 | 2014-10-23

US20140313634A1

Dielectric composition, multilayer ceramic capacitor using the same, and method for manufacturing multilayer ceramic capacitor

#18 | 2014-09-18

US20140268485A1

Conductive paste for external electrodes and multilayer ceramic electronic component using the same

#19 | 2014-09-18

US20140262463A1

EMBEDDED MULTILAYER CERAMIC ELECTRONIC COMPONENT AND PRINTED CIRCUIT BOARD HAVING THE SAME

#20 | 2014-08-21

US20140233150A1

Multilayer ceramic device including crack guide patterns having different structures

#21 | 2014-08-14

US20140226255A1

Multilayer ceramic device having a crack guide pattern

#22 | 2014-07-03

US20140185189A1

Multilayer ceramic capacitor and method of manufacturing the same

#23 | 2014-07-03

US20140185184A1

MULTILAYER CERAMIC CAPACITOR AND MOUNTING BOARD THEREFOR

#24 | 2014-07-03

US20140185183A1

Chemistry; metallurgy

DIELECTRIC COMPOSITION AND MULTILAYER CERAMIC CAPACITOR USING THE SAME

#25 | 2014-06-12

US20140160625A1

Multilayer ceramic device

#26 | 2014-06-12

US20140160620A1

Multilayer ceramic electronic component capable of reducing acoustic noise generated therein

#27 | 2014-06-12

US20140160619A1

Multilayer ceramic electronic component including electrode lead out portions having different lengths

#28 | 2014-06-12

US20140160617A1

Multilayer ceramic capacitor and method of manufacturing the same

#29 | 2014-05-29

US20140146436A1

Multilayer ceramic electronic component

#30 | 2014-05-29

US20140144687A1

Multilayered ceramic capacitor and mounting structure of circuit board having multilayered ceramic capacitor mounted thereon

#31 | 2014-05-08

US20140126104A1

Multilayered ceramic electronic component and manufacturing method thereof

#32 | 2014-04-24

US20140111300A1

Performing operations; transporting

MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME

#33 | 2014-04-17

US20140104750A1

Multi-layered ceramic capacitor

#34 | 2014-01-09

US20140009867A1

Multilayer ceramic electronic component and method of manufacturing the same

#35 | 2013-12-05

US20130321981A1

Laminated chip electronic component, board for mounting the same, and packing unit thereof

#36 | 2013-12-05

US20130319742A1

LAMINATED CHIP ELECTRONIC COMPONENT, BOARD FOR MOUNTING THE SAME, AND PACKING UNIT THEREOF

#37 | 2013-09-19

US20130241361A1

MULTILAYER CERAMIC ELECTRONIC COMPONENT AND FABRICATION METHOD THEREOF

#38 | 2013-09-05

US20130229749A1

Multilayer ceramic electronic component and method of manufacturing the same

#39 | 2012-12-20

US20120320493A1

MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

InventorID:

423018 ⎘