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Inventor profile of:

Shing-Chyang Pan

City:

Hsinchu

Country:

Taiwan

Published Applications:

7

Last publication date:

2021-09-09

Top Assignees for applications by Shing-Chyang Pan

The entities that hold a legal rights for patent applications filed by inventor Pan Shing-Chyang:

  • TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. 3 Hsinchu, Taiwan
  • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 2 Hsin-Chu, Taiwan
  • TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. 1 Hsin-Chu, Taiwan
  • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 1 Hsinchu, Taiwan

Recent patent applications by Pan Shing-Chyang

Shing-Chyang Pan from Hsinchu, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2021-09-09
US20210280460A1
Electricity

Metal-based etch-stop layer

#2 | 2020-02-27
US20200066581A1
Electricity

Metal-based etch-stop layer

#3 | 2019-10-31
US20190333807A1
Electricity

Metal-based etch-stop layer

#4 | 2018-06-07
US20180158658A1
Electricity

Systems and methods for integrated resputtering in a physical vapor deposition chamber

#5 | 2015-07-23
US20150206724A1
Electricity

Systems and methods for integrated resputtering in a physical vapor deposition chamber

#6 | 2008-08-21
US20080199978A1
Physics

System and method for film stress and curvature gradient mapping for screening problematic wafers

#7 | 2005-03-10
US20050054202A1
Electricity

Method for simultaneous degas and baking in copper damascene process

InventorID:

4236427 ⎘

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