Teppei Doi

City:

Makinohara-shi

Country:

Japan

Published Applications:

Last publication date:

2023-11-02

Top Assignees for applications by Teppei Doi

The entities that hold a legal rights for patent applications filed by inventor Doi Teppei:

Teppei Doi from Makinohara-shi, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

ELECTRONIC COMPONENT MODULE

Drip-proof structure, connector with drip-proof structure and electric connection box

Connector

InventorID:

4236473 ⎘