Hidehiro TAKESHIMA

City:

Chuo-ku

Country:

Japan

Published Applications:

Last publication date:

2013-01-03

Top Assignees for applications by Hidehiro TAKESHIMA

The entities that hold a legal rights for patent applications filed by inventor TAKESHIMA Hidehiro:

Hidehiro TAKESHIMA from Chuo-ku, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Stacked semiconductor device and fabrication method for same

Stacked semiconductor device and fabrication method for same

Method of analyzing thermal stress according to filling factor of filler in resin

InventorID:

4264 ⎘