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Inventor profile of:

Ken-ichiro Hiwatari

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2024-09-26

Top Assignees for applications by Ken-ichiro Hiwatari

The entities that hold a legal rights for patent applications filed by inventor Hiwatari Ken-ichiro:

ADEKA CORPORATION 11 Tokyo, Japan
National University Corporation Tokyo Medical and Dental University 2 Tokyo, Japan
JOSHO GAKUEN EDUCATIONAL FOUNDATION 2 Osaka, Japan
SAPPORO MEDICAL UNIVERSITY 2 Hokkaido, Japan
KM Biologics Co., Ltd. 1 Kumamoto, Japan
THE KANSAI ELECTRIC POWER COMPANY, INC. 1 OSAKA, Japan
Kansai Electric Power Company, Inc. 1 Osaka, Japan
Adeka Coporation 1 Tokyo, Japan
SAPPORO MEDICAL UNIVERSITY 1 Sapporo-shi, Hokkaido, Japan
THE CHEMO-SERO-THERAPEUTIC RESEARCH INSTITUTE 1 Kumamoto, Japan
ADEKA CORPORATION 1 Arakawa-ku, Tokyo, Japan

Recent patent applications by Hiwatari Ken-ichiro

Ken-ichiro Hiwatari from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2024-09-26

US20240316250A1

Human necessities

HYBRID GEL COMPRISING PARTICULATE DECELLULARIZED TISSUE

#2 | 2022-10-13

US20220323647A1

Human necessities

SHEET OF BIOLOGICAL TISSUE, TUBULAR STRUCTURE OBTAINED FROM SAID SHEET, AND ARTIFICIAL BLOOD VESSEL COMPRISING SAID TUBULAR STRUCTURE

#3 | 2020-10-15

US20200324024A1

Human necessities

DECELLULARIZED TISSUE

#4 | 2020-04-16

US20200114044A1

Human necessities

DECELLULARIZED TISSUE

#5 | 2018-10-18

US20180296728A1

Human necessities

SHEET OF BIOLOGICAL TISSUE, TUBULAR STRUCTURE OBTAINED FROM SAID SHEET, AND ARTIFICIAL BLOOD VESSEL COMPRISING SAID TUBULAR STRUCTURE

#6 | 2018-03-22

US20180078679A1

Human necessities

Anti-adhesion material and substitute biomembrane using decellularized tissue

#7 | 2018-02-15

US20180044381A1

Chemistry; metallurgy

Polysaccharide derivative having membrane-permeable peptide chain

#8 | 2018-01-18

US20180016366A1

Chemistry; metallurgy

Polymer compound which has membrane-permeable peptide in side chain

#9 | 2013-01-17

US20130018132A1

Chemistry; metallurgy

Compound having hindered amine backbone, and resin composition

#10 | 2012-05-24

US20120126435A1

Electricity

Curable composition for semiconductor encapsulation

#11 | 2010-07-15

US20100179283A1

Chemistry; metallurgy

Silicon-containing compound, curable composition and cured product

#12 | 2009-03-19

US20090075301A1

Human necessities

Diagnostic marker

#13 | 2007-08-23

US20070197755A1

Chemistry; metallurgy

Silicon-containing curing composition and heat cured product thereof

InventorID:

42763 ⎘