Da Wang

City:

Jiangsu

Country:

China

Published Applications:

Last publication date:

2008-12-25

Top Assignees for applications by Da Wang

The entities that hold a legal rights for patent applications filed by inventor Wang Da:

Da Wang from Jiangsu, CN has applied for patents for these inventions. The list has both pending applications and granted patents:

Package Structure with Flat Bumps for Integrate Circuit or Discrete Device and Method of Manufacture the Same

Packaging Substrate with Flat Bumps for Electronic Devices and Method of Manufacturing the Same

Package Structure With Flat Bumps For Electronic Device and Method of Manufacture the Same

InventorID:

4277279 ⎘