Jiaping Wang

City:

Vienna, Virginia

Country:

United States

Published Applications:

Last publication date:

2008-11-06

Top Assignees for applications by Jiaping Wang

The entities that hold a legal rights for patent applications filed by inventor Wang Jiaping:

Jiaping Wang from Vienna, US has applied for patents for these inventions. The list has both pending applications and granted patents:

METHOD FOR MAKING NANOSTRUCTURED SOLDERED OR BRAZED JOINTS WITH REACTIVE MULTILAYER FOILS

Method of controlling thermal waves in reactive multilayer joining and resulting product

Nanostructured soldered or brazed joints made with reactive multilayer foils

InventorID:

4286836 ⎘