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Inventor profile of:

Bucknell C. Webb

City:

Country:

United States

Published Applications:

1

Last publication date:

2008-11-06

Top Assignees for applications by Bucknell C. Webb

The entities that hold a legal rights for patent applications filed by inventor Webb Bucknell C.:

INTERNATIONAL BUSINESS MACHINES CORPORATION 1 ARMONK, NY United States

Recent patent applications by Webb Bucknell C.

Bucknell C. Webb from , US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2008-11-06

US20080274583A1

Through-wafer vias

InventorID:

4288449 ⎘