Aichi
Japan
12
2008-11-27
The entities that hold a legal rights for patent applications filed by inventor Otsuka Jun:
Jun Otsuka from Aichi, JP has applied for patents for these inventions. The list has both pending applications and granted patents:
Wiring Board and Wiring Board Manufacturing Method
#2 | 2008-11-13Wiring board with built-in component and method for manufacturing the same
#3 | 2008-10-16Capacitor and wiring board including the capacitor
#4 | 2008-02-05Assembly of semiconductor device, interposer and substrate
#5 | 2006-11-02Capacitor and method for manufacturing the same
#6 | 2005-11-01Capacitor, capacitor equipped semiconductor device assembly, capacitor equipped circuit substrate assembly and electronic unit including semiconductor device, capacitor and circuit substrate
#7 | 2005-06-09Capacitor and method for manufacturing the same
#8 | 2005-06-09Capacitor and method for manufacturing the same
#9 | 2005-04-14Ceramic substrate for thin-film electronic components, method for producing the substrate, and thin-film electronic component employing the substrate
#10 | 2005-04-07Ceramic substrate for thin film electronic component, production method for the same and thin film electronic component using the same
#11 | 2005-03-10Method for producing ceramic substrate, and ceramic substrate
#12 | 2005-01-13Multi-layer capacitor and method for producing the same
4298720 ⎘