Gilbert, Arizona
United States
214
2026-05-07
The entities that hold a legal rights for patent applications filed by inventor Seddon Michael J.:
Michael J. Seddon from Gilbert, US has applied for patents for these inventions. The list has both pending applications and granted patents:
SEMICONDUCTOR MODULE WITH POWER BRIDGE FOR INTEGRATED DIE INTERCONNECTION
#2 | 2026-05-07SEMICONDUCTOR PACKAGING WITH EMBEDDED DEVICE AND REDISTRIBUTION LAYER
#3 | 2026-02-12SEMICONDUCTOR PACKAGE ELECTRICAL CONTACT STRUCTURES AND RELATED METHODS
#4 | 2026-01-22SEMICONDUCTOR PACKAGE ELECTRICAL CONTACTS AND RELATED METHODS
#5 | 2026-01-15SILICON-ON-INSULATOR DIE SUPPORT STRUCTURES AND RELATED METHODS
#6 | 2025-11-13DIE SIDEWALL COATINGS AND RELATED METHODS
#7 | 2025-11-13SEMICONDUCTOR DEVICES HAVING DIE SUPPORT STRUCTURES AND RELATED METHODS
#8 | 2025-09-11PAD METALLIZATION SYSTEMS AND RELATED METHODS
#9 | 2025-09-11PAD METALLIZATION SYSTEMS AND RELATED METHODS
#10 | 2025-09-04COPPER PAD INTERCONNECT SYSTEMS AND RELATED METHODS
#11 | 2025-08-21SUBSTRATE ALIGNMENT SYSTEMS AND RELATED METHODS
#12 | 2025-07-17DUAL SIDE DIRECT COOLING SEMICONDUCTOR PACKAGE
#13 | 2025-07-17DIE CLEANING SYSTEMS AND RELATED METHODS
#14 | 2025-07-17SEMICONDUCTOR PACKAGE STRESS BALANCE STRUCTURES AND RELATED METHODS
#15 | 2025-07-17SEMICONDUCTOR PACKAGE STRESS BALANCE STRUCTURES AND RELATED METHODS
#16 | 2025-07-03NON-PLANAR SEMICONDUCTOR PACKAGING SYSTEMS AND RELATED METHODS
#17 | 2025-06-19SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER
#18 | 2025-06-05SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER
#19 | 2025-05-22SOI SUBSTRATE AND RELATED METHODS
#20 | 2025-05-22SOI SUBSTRATE AND RELATED METHODS
#21 | 2025-05-08SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUCTURES
#22 | 2025-05-08SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUCTURES
#23 | 2025-05-08IMMERSION DIRECT COOLING MODULES AND RELATED METHODS
#24 | 2025-05-08DIE CLEANING SYSTEMS AND RELATED METHODS
#25 | 2025-04-03WIRE-IN-DAM PACKAGES AND RELATED SYSTEMS AND METHODS
#26 | 2025-02-20SEMICONDUCTOR WAFER AND METHOD OF BALL DROP ON THIN WAFER WITH EDGE SUPPORT RING
#27 | 2025-02-20JET ABLATION DIE SINGULATION SYSTEMS AND RELATED METHODS
#28 | 2025-02-20SEMICONDUCTOR WAFER AND METHOD OF WAFER THINNING
#29 | 2025-02-13COPPER PAD METALLIZATION SYSTEMS AND RELATED METHODS
#30 | 2025-01-23TEMPORARY SUBSTRATE CARRIERS
#31 | 2025-01-23COPPER FEATURES AND RELATED METHODS OF FORMING
#32 | 2025-01-16MULTIDIE SUPPORTS AND RELATED METHODS
#33 | 2025-01-16SUPPORTS FOR THINNED SEMICONDUCTOR SUBSTRATES AND RELATED METHODS
#34 | 2024-11-28TAPE HEATING METHODS
#35 | 2024-10-03DIE SIDEWALL COATINGS AND RELATED METHODS
#36 | 2024-09-05Through-substrate via structure and method of manufacture
#37 | 2024-09-05CURVED SEMICONDUCTOR DIE SYSTEMS AND RELATED METHODS
#38 | 2024-07-18SINGULATION SYSTEMS AND RELATED METHODS
#39 | 2024-06-20SOI substrate and related methods
#40 | 2024-06-20SEMICONDUCTOR PACKAGES WITH DIE INCLUDING CAVITIES AND RELATED METHODS
#41 | 2024-06-06BACKSIDE METAL PATTERNING DIE SINGULATION SYSTEM AND RELATED METHODS
#42 | 2024-05-30Backside metal patterning die singulation systems and related methods
#43 | 2024-05-02Non-planar semiconductor packaging systems and related methods
#44 | 2024-03-07Supports for thinned semiconductor substrates and related methods
#45 | 2024-03-07Die cleaning systems and related methods
#46 | 2023-12-21Jet ablation die singulation systems and related methods
#47 | 2023-11-16CONFIGURABLE LOW OHMIC POWER CIRCUITS
#48 | 2023-11-16LIQUID PHASE BONDING FOR ELECTRICAL INTERCONNECTS IN SEMICONDUCTOR PACKAGES
#49 | 2023-09-28Semiconductor device and method of forming micro interconnect structures
#50 | 2023-09-28SUBSTRATE PROCESSING CARRIER
#51 | 2023-06-01Backside metal patterning die singulation system and related methods
#52 | 2023-01-26Backside metal patterning die singulation systems and related methods
#53 | 2023-01-26SOI substrate and related methods
#54 | 2023-01-19Dual side direct cooling semiconductor package
#55 | 2022-12-22Immersion direct cooling modules
#56 | 2022-12-22IMMERSION COOLING PACKAGE
#57 | 2022-12-01SEMICONDUCTOR PACKAGE ELECTRICAL CONTACT STRUCTURES AND RELATED METHODS
#58 | 2022-11-17MULTICHIP MODULE SUPPORTS AND RELATED METHODS
#59 | 2022-11-03Multidie supports and related methods
#60 | 2022-11-03Die sidewall coatings and related methods
#61 | 2022-10-06Substrate alignment systems and related methods
#62 | 2022-09-22SILICON-ON-INSULATOR DIE SUPPORT STRUCTURES AND RELATED METHODS
#63 | 2022-08-25SEMICONDUCTOR PACKAGE ELECTRICAL CONTACTS AND RELATED METHODS
#64 | 2022-08-04Semiconductor packages with die including cavities
#65 | 2022-07-28Backmetal removal methods
#66 | 2022-06-02Structures for aligning a semiconductor wafer for singulation
#67 | 2022-05-26Singulation systems and related methods
#68 | 2022-03-17Semiconductor wafer and method of probe testing
#69 | 2022-01-27Semiconductor wafer and method of ball drop on thin wafer with edge support ring
#70 | 2021-12-09Backside metal removal die singulation systems and related methods
#71 | 2021-12-02Semiconductor substrate processing methods
#72 | 2021-11-04Multidie supports for reducing die warpage
#73 | 2021-11-04Supports for thinned semiconductor substrates and related methods
#74 | 2021-11-04SEMICONDUCTOR PACKAGES WITH PASSIVATING MATERIAL ON DIE SIDEWALLS AND RELATED METHODS
#75 | 2021-11-04Multichip module supports and related methods
#76 | 2021-11-04Substrate processing carrier
#77 | 2021-11-04Semiconductor substrate crack mitigation systems and related methods
#78 | 2021-11-04Curved semiconductor die systems and related methods
#79 | 2021-11-04Temporary die support structures and related methods
#80 | 2021-11-04Non-planar semiconductor packaging systems and related methods
#81 | 2021-11-04LASER CONTACT ABLATION FOR SEMICONDUCTOR PACKAGES AND RELATED METHODS
#82 | 2021-10-21Semiconductor packages with an intermetallic layer
#83 | 2021-09-02Semiconductor device with backmetal and related methods
#84 | 2021-09-02Jet ablation die singulation systems and related methods
#85 | 2021-08-19Semiconductor wafer and method of wafer thinning
#86 | 2021-07-15Backside metal patterning die singulation system and related methods
#87 | 2021-06-03Through-substrate via structure and method of manufacture
#88 | 2021-04-22Tape heating methods
#89 | 2021-04-22Backside metal photolithographic patterning die singulation systems and related methods
#90 | 2021-04-22Semiconductor substrate singulation systems and related methods
#91 | 2021-03-18Plasma die singulation systems and related methods
#92 | 2021-03-11Jet ablation die singulation systems and related methods
#93 | 2021-02-11Semiconductor device and method of forming micro interconnect structures
#94 | 2021-02-11Backside metal patterning die singulation systems and related methods
#95 | 2021-02-04Semiconductor package stress balance structures and related methods
#96 | 2021-01-28Methods of aligning a semiconductor wafer for singulation
#97 | 2021-01-21Backside metal patterning die singulation systems and related methods
#98 | 2020-12-31Semiconductor substrate production systems and related methods
#99 | 2020-12-17Semiconductor package electrical contact structures and related methods
#100 | 2020-11-19Backside wafer alignment methods
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