Poughkeepsie, New York
United States
24
2020-03-12
The entities that hold a legal rights for patent applications filed by inventor WEI Xiaojin:
Xiaojin WEI from Poughkeepsie, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Heat pipe and vapor chamber heat dissipation
#2 | 2019-12-05Battery pack capacity optimization via self-regulation of cell temperature
#3 | 2019-09-26Cooled containment compartments for packaged battery cells
#4 | 2019-09-12BLAST TUBING FOR PACKAGING BATTERY CELLS
#5 | 2019-09-12Containment heatsink for packaged battery cells
#6 | 2019-02-28Cooled containment compartments for packaged battery cells
#7 | 2019-02-28Cooled containment compartments for packaged battery cells
#8 | 2018-10-04Heat pipe and vapor chamber heat dissipation
#9 | 2018-08-07Heat pipe and vapor chamber heat dissipation
#10 | 2018-05-22Heat pipe and vapor chamber heat dissipation
#11 | 2016-12-08Control of solid state memory device temperature using queue depth management
#12 | 2016-10-06Flexible coolant manifold—heat sink assembly
#13 | 2016-09-08Manufacturing electronic package with heat transfer element(s)
#14 | 2016-09-08Electronic package with heat transfer element(s)
#15 | 2016-08-18Flexible coolant manifold-heat sink assembly
#16 | 2016-07-28Changeable, airflow venting cover assembly for an electronics rack
#17 | 2016-06-16Control of solid state memory device temperature using queue depth management
#18 | 2016-05-19Thermal management in a multi-phase power system
#19 | 2016-05-19Thermal management in a multi-phase power system
#20 | 2015-09-17Control of solid state memory device temperature using queue depth management
#21 | 2013-09-12Structures and methods to reduce maximum current density in a solder ball
#22 | 2011-06-23Structures and methods to reduce maximum current density in a solder ball
#23 | 2011-05-05Thermoelectric 3D cooling
#24 | 2010-07-15Thermoelectric 3D cooling
430033 ⎘