Robert C. Hartmann

City:

Apopka, Florida

Country:

United States

Published Applications:

Last publication date:

2014-04-17

Top Assignees for applications by Robert C. Hartmann

The entities that hold a legal rights for patent applications filed by inventor Hartmann Robert C.:

Robert C. Hartmann from Apopka, US has applied for patents for these inventions. The list has both pending applications and granted patents:

FLIP-CHIP PACKAGING TECHNIQUES AND CONFIGURATIONS

Wafer level package with embedded passive components and method of manufacturing

FLIP-CHIP PACKAGING TECHNIQUES AND CONFIGURATIONS

InventorID:

430046 ⎘