Paul D. Bantz

City:

Los Altos, California

Country:

United States

Published Applications:

Last publication date:

2015-04-30

Top Assignees for applications by Paul D. Bantz

The entities that hold a legal rights for patent applications filed by inventor Bantz Paul D.:

Paul D. Bantz from Los Altos, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Advanced grounding scheme

Thermal via structures with surface features

FLIP-CHIP PACKAGING TECHNIQUES AND CONFIGURATIONS

FLIP-CHIP PACKAGING TECHNIQUES AND CONFIGURATIONS

InventorID:

430047 ⎘