John H. Epple

City:

St. Louis, Missouri

Country:

United States

Published Applications:

Last publication date:

2008-12-04

Top Assignees for applications by John H. Epple

The entities that hold a legal rights for patent applications filed by inventor Epple John H.:

John H. Epple from St. Louis, US has applied for patents for these inventions. The list has both pending applications and granted patents:

ADHESIVE BONDING WITH LOW TEMPERATURE GROWN AMORPHOUS OR POLYCRYSTALLINE COMPOUND SEMICONDUCTORS

Adhesive bonding with low temperature grown amorphous or polycrystalline compound semiconductors

InventorID:

4303262 ⎘