Jeffrey Lien

City:

Taipei

Country:

Taiwan

Published Applications:

Last publication date:

2007-01-04

Top Assignees for applications by Jeffrey Lien

The entities that hold a legal rights for patent applications filed by inventor Lien Jeffrey:

Jeffrey Lien from Taipei, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

METHOD OF FABRICATING A HIGH-DENSITY LEAD ARRANGEMENT PACKAGE STRUCTURE

Packaging method for integrated circuits

Concealable chip leadframe unit structure

Manufacturing method of a modularized leadframe

Chip package structure

InventorID:

4328554 ⎘