Jong-Ning Aoh

City:

Chia-Yi

Country:

Taiwan

Published Applications:

Last publication date:

2007-01-18

Top Assignees for applications by Jong-Ning Aoh

The entities that hold a legal rights for patent applications filed by inventor Aoh Jong-Ning:

NATIONAL CHUNG CHENG UNIVERSITY 1 Chia-Yi, Taiwan

Recent patent applications by Aoh Jong-Ning

Jong-Ning Aoh from Chia-Yi, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2007-01-18

US20070015352A1

Electricity

Method of realizing thermosonic wire bonding between metal wires and copper pads by depositing a thin film to surface of semiconductor chip with copper pads

InventorID:

4338552 ⎘