Dae Young Lee

City:

Ansan

Country:

South Korea

Published Applications:

Last publication date:

2013-09-12

Top Assignees for applications by Dae Young Lee

The entities that hold a legal rights for patent applications filed by inventor Lee Dae Young:

Dae Young Lee from Ansan, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

Method of fabricating a package substrate

Solder bump forming apparatus and soldering facility including the same

Power-saving LED lighting apparatus

Package substrate capable of controlling the degree of warpage

Package substrate and method of fabricating the same

InventorID:

433978 ⎘