Michael P. Pierce

City:

Plano, Texas

Country:

United States

Published Applications:

Last publication date:

2007-01-25

Top Assignees for applications by Michael P. Pierce

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Michael P. Pierce from Plano, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Low profile, chip-scale package and method of fabrication

Low profile, chip-scale package and method of fabrication

InventorID:

4343099 ⎘