Kenneth P. Rodbell

FORMATION OF AN EPITAXIAL BARRIER BETWEEN A SEMICONDUCTOR SUBSTRATE AND A METAL RESONATOR FOR IMPROVED SUBSTRATE METAL PARTICIPATION

Evaluation of wafer carcass alpha particle emission

Qubits with ion implant Josephson junctions

Sacrificial material facilitating protection of a substrate in a qubit device

Lithography for fabricating Josephson junctions

Reducing error rates with alpha particle protection

Integrated reactive material erasure element with phase change memory

Heterogeneous miniaturization platform

Measuring flux, current, or integrated charge of low energy particles

Fragmenting computer chips

Thin film interconnects with large grains

Energy release using tunable reactive materials

Real time X-ray dosimeter using diodes with variable thickness degrader

Real time X-ray dosimeter using diodes with variable thickness degrader

Measuring flux, current, or integrated charge of low energy particles

Heterogeneous miniaturization platform

Fragmenting computer chips

Chemically strengthened glass and methods of making same

Activating reactions in integrated circuits through electrical discharge

Damaging integrated circuit components

Damaging integrated circuit components

Tamper-proof electronic packages formed with stressed glass

Tamper-proof electronic packages with stressed glass component substrate(s)

Sensors including complementary lateral bipolar junction transistors

Heterogeneous miniaturization platform

Integrated arming switch and arming switch activation layer for secure memory

Energy release using tunable reactive materials

Chemically strengthened glass and methods of making same

Chemically strengthened glass and methods of making same

Chemically strengthened glass and methods of making same

Sensors including complementary lateral bipolar junction transistors

Integrated reactive material erasure element with phase change memory

Preventing unauthorized use of integrated circuits for radiation-hard applications

Activating reactions in integrated circuits through electrical discharge

Controlling fragmentation of chemically strengthened glass

Preventing unauthorized use of integrated circuits for radiation-hard applications

Activating reactions in integrated circuits through electrical discharge

Controlling fragmentation of chemically strengthened glass

Activating reactions in integrated circuits through electrical discharge

Boron rich nitride cap for total ionizing dose mitigation in SOI devices

Thin film interconnects with large grains

Boron rich nitride cap for total ionizing dose mitigation in SOI devices

Formation of alpha particle shields in chip packaging

Integrated circuits with radioactive source material and radiation detection

Method of consumer/producer raw material selection

Fabricating a small-scale radiation detector

Method for conversion of commercial microprocessor to radiation-hardened processor and resulting processor

Microstructure modification in copper interconnect structures

Reactive material for integrated circuit tamper detection and response

Multi-doped silicon antifuse device for integrated circuit

Integrated circuit tamper detection and response

MICROSTRUCTURE MODIFICATION IN COPPER INTERCONNECT STRUCTURES

Microstructure modification in copper interconnect structures

Tunable radiation source

On-chip radiation dosimeter

Fully depleted silicon on insulator neutron detector

On-chip radiation dosimeter

METHOD AND STRUCTURE OF FORMING SILICIDE AND DIFFUSION BARRIER LAYER WITH DIRECT DEPOSITED FILM ON SI

Formation of alpha particle shields in chip packaging

Ionizing radiation blocking in IC chip to reduce soft errors

Alpha particle blocking wire structure and method fabricating same

Method and structure of forming silicide and diffusion barrier layer with direct deposited film on silicon

METHOD FOR CONVERSION OF COMMERCIAL MICROPROCESSOR TO RADIATION-HARDENED PROCESSOR AND RESULTING PROCESSOR

Microstructure modification in copper interconnect structure

Silicide interconnect structure

Discrete placement of radiation sources on integrated circuit devices

Microstructure modification in copper interconnect structure

RADIATION DETECTION SCHEMES, APPARATUS AND METHODS OF TRANSMITTING RADIATION DETECTION INFORMATION TO A NETWORK

Method and structures for accelerated soft-error testing

CMOS storage devices configurable in high performance mode or radiation tolerant mode

Ionizing radiation blocking in IC chip to reduce soft errors

Formation of alpha particle shields in chip packaging

High temperature processing compatible metal gate electrode for pFETS and methods for fabrication

Method of detecting and transmitting radiation detection information to a network

STABILIZATION OF Ni MONOSILICIDE THIN FILMS IN CMOS DEVICES USING IMPLANTATION OF IONS BEFORE SILICIDATION

Static random access memory cell with improved stability

Method and structure for reducing contact resistance between silicide contact and overlying metallization

Method for reduction of soft error rates in integrated circuits

Homogeneous Copper Interconnects for BEOL

Method and structure for reducing contact resistance between silicide contact and overlying metallization

Static random access memory cell with improved stability

Alpha particle shields in chip packaging

Stabilization of Ni monosilicide thin films in CMOS devices using implantation of ions before silicidation

Method and structure for reduction of soft error rates in integrated circuits

Homogeneous Copper Interconnects for BEOL

Polishing pads with polymer filled fibrous web, and methods for fabricating and using same

Optimization of storage and power consumption with soft error predictor-corrector

Method for plating copper conductors and devices formed

Method for electroplating on resistive substrates

Stabilization of Ni monosilicide thin films in CMOS devices using implantation of ions before silicidation

Method for electroplating on resistive substrates

Automatic exchange of degraders in accelerated testing of computer chips

Method and apparatus for thin film thickness mapping