Mark Allen Gerber

City:

Plano, Texas

Country:

United States

Published Applications:

Last publication date:

2007-03-08

Top Assignees for applications by Mark Allen Gerber

The entities that hold a legal rights for patent applications filed by inventor Gerber Mark Allen:

Mark Allen Gerber from Plano, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Package-on-package semiconductor assembly

Enhanced multi-die package

Double density method for wirebond interconnect

Method and apparatus for packaging an electronic chip

Method and apparatus for providing a BGA connection having improved drop test performance

Double density method for wirebond interconnect

InventorID:

4350486 ⎘