David B. Tuckerman

Microelectronic component with photo-imageable substrate

Microelectronic package optionally having differing cover and device thermal expansivities

Image sensor employing a plurality of photodetector arrays and/or rear-illuminated architecture

Wire bonded wafer level cavity package

Compact lens turret assembly

Structure and method of forming capped chips

Connection structures for microelectronic devices and methods for forming such structures

Structure with spherical contact pins

Chip handling methods and apparatus

Hermetically sealed image sensor module and method of fabricating same

High-frequency chip packages

Packaged acoustic and electromagnetic transducer chips

Packaged acoustic and electromagnetic transducer chips

Micro pin grid array with pin motion isolation

Package element and packaged chip having severable electrically conductive ties

Formation of circuitry with modification of feature height

Structure and method of making capped chips having vertical interconnects

Back-face and edge interconnects for lidded package

Structure and method of making sealed capped chips

Package having integral lens and wafer-scale fabrication method therefor