Inventor profile of:

Albert Birner

City:

Dresden

Country:

Germany

Published Applications:

20

Last publication date:

2007-09-11

Top Assignees for applications by Albert Birner

The entities that hold a legal rights for patent applications filed by inventor Birner Albert:

Recent patent applications by Birner Albert

Albert Birner from Dresden, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2007-09-11
US10486758
-

Memory cell with trench capacitor and vertical select transistor and an annular contact-making region formed between them

#2 | 2007-05-10
US20070105302A1
Electricity

Integrated circuit formed on a semiconductor substrate

#3 | 2007-05-10
US20070105262A1
Electricity

Method for fabricating an integrated circuit with a CMOS manufacturing process

#4 | 2007-04-24
US10484562
-

Method for fabricating a vertical transistor in a trench, and vertical transistor

#5 | 2007-02-15
US20070034927A1
Electricity

Trench storage capacitor

#6 | 2007-02-13
US10413812
-

Method and configuration for reinforcement of a dielectric layer at defects by self-aligning and self-limiting electrochemical conversion of a substrate material

#7 | 2007-01-02
US10653599
-

Barrier layer and a method for suppressing diffusion processes during the production of semiconductor devices

#8 | 2006-08-01
US10792691
-

Method for forming an SOI substrate, vertical transistor and memory cell with vertical transistor

#9 | 2006-07-25
US10823607
-

Method of forming a silicon dioxide layer

#10 | 2006-07-11
US10436427
-

Method for fabricating trench capacitors for large scale integrated semiconductor memories

#11 | 2006-01-26
US20060017132A1
Electricity

Method for producing a dielectric and semiconductor structure

#12 | 2005-12-29
US20050285150A1
Electricity

Transistor arrangement in monocrystalline substrate having stress exerting insulators

#13 | 2005-07-21
US20050158945A1
Electricity

Memory cell and method for fabricating it

#14 | 2005-07-19
US10630373
-

Semiconductor trench structure

#15 | 2005-06-16
US20050127421A1
Electricity

Semiconductor module having an insulation layer and method for fabricating a semiconductor module having an insulation layer

#16 | 2005-06-07
US10324874
-

Contact spring configuration for contacting a semiconductor wafer and method for producing a contact spring configuration

#17 | 2005-04-12
US10436426
-

Method for fabricating trench capacitors and semiconductor device with trench capacitors

#18 | 2005-03-08
US10661340
-

Configuration and method for making contact with the back surface of a semiconductor substrate

#19 | 2005-03-01
US10233969
-

Method for fabricating a trench structure

#20 | 2005-01-20
US20050014335A1
Performing operations; transporting

Method for fabricating a memory cell

InventorID:

4354852 ⎘