🔗 Permalink

Inventor profile of:

Ming-Hung Su

City:

Tainan

Country:

Taiwan

Published Applications:

1

Last publication date:

2007-02-15

Recent patent applications by Su Ming-Hung

Ming-Hung Su from Tainan, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2007-02-15

US20070035008A1

Thin IC package for improving heat dissipation from chip backside

InventorID:

4354894 ⎘