Kun-Wei Lin

City:

Tainan

Country:

Taiwan

Published Applications:

Last publication date:

2014-02-27

Top Assignees for applications by Kun-Wei Lin

The entities that hold a legal rights for patent applications filed by inventor Lin Kun-Wei:

Kun-Wei Lin from Tainan, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

Compound barrier layer, method for forming the same and package structure using the same

Flexible base material and flexible electronic device

Optical devices

InventorID:

4358239 ⎘