Michael D. Cusack

City:

Boise, Idaho

Country:

United States

Published Applications:

Last publication date:

2011-09-20

Top Assignees for applications by Michael D. Cusack

The entities that hold a legal rights for patent applications filed by inventor Cusack Michael D.:

Michael D. Cusack from Boise, US has applied for patents for these inventions. The list has both pending applications and granted patents:

System and method for routing supply voltages or other signals between side-by-side die and a lead frame for system in a package (SIP) devices

Quad flat pack (QFP) package and flexible power distribution method therefor

Integrated circuit with copper interconnect and top level bonding/interconnect layer

InventorID:

4363968 ⎘