William H. Sisson

City:

Corvallis, Oregon

Country:

United States

Published Applications:

Last publication date:

2007-10-18

Top Assignees for applications by William H. Sisson

The entities that hold a legal rights for patent applications filed by inventor Sisson William H.:

Avago Technologies General IP (Singapore) Pte. Ltd. 2 Singapore, Singapore

Recent patent applications by Sisson William H.

William H. Sisson from Corvallis, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2007-10-18

US20070242434A1

Electricity

System and method for inducing turbulence in fluid for dissipating thermal energy of electronic circuitry

#2 | 2007-03-01

US20070047213A1

Electricity

Circuit board with multiple layer interconnect and method of manufacture

InventorID:

4365021 ⎘