Edward LAW

Thin recon interposer package without TSV for fine input/output pitch fan-out

RECONSTITUTED INTERPOSER SEMICONDUCTOR PACKAGE

Thin recon interposer package without TSV for fine input/output pitch fan-out

Embedded substrate core spiral inductor

Semiconductor border protection sealant

RECONSTITUTED INTERPOSER SEMICONDUCTOR PACKAGE

RECONSTITUTION TECHNIQUES FOR SEMICONDUCTOR PACKAGES

Magnetic-core three-dimensional (3D) inductors and packaging integration

Fabricating a wafer level semiconductor package having a pre-formed dielectric layer

Wafer level semiconductor package

Method of fabricating a wafer level semiconductor package having a pre-formed dielectric layer

Multi-chip and multi-substrate reconstitution based packaging

Method and apparatuses for integrated circuit substrate manufacture

Aluminum Bond Pad With Trench Thinning for Fine Pitch Ultra-Thick Aluminum Products

Chip scale package assembly in reconstitution panel process format

WAFER BUMPING USING PRINTED UNDER BUMP METALIZATION

DIRECT THROUGH VIA WAFER LEVEL FANOUT PACKAGE

Thermal enhanced package using embedded substrate

Bumping free flip chip process

WAFER BUMPING USING PRINTED UNDER BUMP METALIZATION

DEPOPULATING INTEGRATED CIRCUIT PACKAGE BALL LOCATIONS TO ENABLE IMPROVED EDGE CLEARANCE IN SHIPPING TRAY

Low profile ball grid array (BGA) package with exposed die and method of making same

Integrated circuit package having exposed thermally conducting body