John N. Stipp

City:

Alsip, Illinois

Country:

United States

Published Applications:

Last publication date:

2007-03-08

Recent patent applications by Stipp John N.

John N. Stipp from Alsip, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Method of controlling solder deposition on heat spreader used for semiconductor package

Method of controlling solder deposition utilizing two fluxes and preform

InventorID:

4368409 ⎘