John J. Hackett

City:

Williamstown, New Jersey

Country:

United States

Published Applications:

Last publication date:

2007-03-08

Recent patent applications by Hackett John J.

John J. Hackett from Williamstown, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2007-03-08

US20070054609A1

Performing operations; transporting

Dual purpose sanding and collecting abrading device

InventorID:

4370570 ⎘