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Inventor profile of:

Daisuke Souma

City:

Tochigi

Country:

Japan

Published Applications:

2

Last publication date:

2007-10-16

Top Assignees for applications by Daisuke Souma

The entities that hold a legal rights for patent applications filed by inventor Souma Daisuke:

SENJU METAL INDUSTRY CO., LTD 2 Tokyo, Japan

Recent patent applications by Souma Daisuke

Daisuke Souma from Tochigi, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2007-10-16

US10824647

Lead-free solder

#2 | 2007-03-29

US20070069379A1

Chemistry; metallurgy

Lead-free solder ball

InventorID:

4382148 ⎘