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Inventor profile of:

David Lee

City:

Hsinchu

Country:

Taiwan

Published Applications:

8

Last publication date:

2007-04-05

Top Assignees for applications by David Lee

The entities that hold a legal rights for patent applications filed by inventor Lee David:

  • UNITED MICROELECTRONICS CORPORATION 2 Hsinchu, Taiwan
  • UNITED MICROELECTRONICS CORP. 1 Hsin-Chu, Taiwan
  • UNITED MICROELECTRONICS CORP. 1 Hsinchu, Taiwan

Recent patent applications by Lee David

David Lee from Hsinchu, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2007-04-05
US20070076339A1
Electricity

AIR GAP FOR TUNGSTEN/ALUMINUM PLUG APPLICATIONS

#2 | 2006-11-21
US10295080
-

Air gap for tungsten/aluminum plug applications

#3 | 2006-01-19
US20060014388A1
Electricity

Wafer processing apparatus & methods for depositing cobalt silicide

#4 | 2005-09-13
US10640779
-

Wafer processing apparatus and methods for depositing cobalt silicide

#5 | 2005-08-18
US20050179139A1
Electricity

Semiconductor device with cobalt silicide contacts

#6 | 2005-08-11
US20050176248A1
Electricity

Semiconductor device with cobalt silicide contacts

#7 | 2005-07-05
US10074550
-

Apparatus and method for serial data communication between plurality of chips in a chip set

#8 | 2005-04-12
US10641232
-

Semiconductor device with cobalt silicide contacts and method of making the same

InventorID:

4387168 ⎘

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