Yasuhiro Murai

City:

Chikusei

Country:

Japan

Published Applications:

Last publication date:

2007-04-05

Top Assignees for applications by Yasuhiro Murai

The entities that hold a legal rights for patent applications filed by inventor Murai Yasuhiro:

Yasuhiro Murai from Chikusei, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Low dielectric loss tangent-resin varnish, prepreg, laminated sheet, and printed wiring board using the varnish

InventorID:

4387883 ⎘