🔗 Permalink

Inventor profile of:

Thomas E. Dueber

City:

Wilmington, Delaware

Country:

United States

Published Applications:

Last publication date:

2007-12-20

Top Assignees for applications by Thomas E. Dueber

The entities that hold a legal rights for patent applications filed by inventor Dueber Thomas E.:

E. I. DU PONT DE NEMOURS AND COMPANY 2 Wilmington, DE United States
E.I. DU PONT DE NEMOURS AND COMPANY 2 Wilmington, DE United States
E I Dupont De Nemours and Company 1 Wilmington, DE United States
E.I. DUPONT DE NEMOURS 1 WILMINGTON, DE United States

Recent patent applications by Dueber Thomas E.

Thomas E. Dueber from Wilmington, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2007-12-20

US20070291440A1

Electricity

Organic encapsulant compositions based on heterocyclic polymers for protection of electronic components

#2 | 2007-12-20

US20070290379A1

Chemistry; metallurgy

Hydrophobic compositions for electronic applications

#3 | 2007-10-18

US20070244267A1

Electricity

Hydrophobic crosslinkable compositions for electronic applications

#4 | 2007-10-11

US20070236859A1

Electricity

Organic encapsulant compositions for protection of electronic components

#5 | 2007-04-12

US20070083017A1

Electricity

Composition of polyimide and sterically-hindered hydrophobic epoxy

#6 | 2007-04-12

US20070083016A1

Electricity

Photosensitive polyimide compositions

#7 | 2006-09-21

US20060210819A1

Electricity

Polyimide composite coverlays and methods and compositions relating thereto

#8 | 2006-05-25

US20060110679A1

Electricity

Low-temperature curable photosensitive compositions

#9 | 2006-05-25

US20060110678A1

Electricity

Low-temperature curable photosensitive compositions

#10 | 2005-07-14

US20050154181A1

Chemistry; metallurgy

Polyimide compositions having resistance to water sorption, and methods relating thereto

#11 | 2005-07-14

US20050154105A1

Electricity

Compositions with polymers for advanced materials

#12 | 2005-06-30

US20050143534A1

Performing operations; transporting

Polyimide based adhesive compositions useful in flexible circuit applications, and compositions and methods relating thereto

#13 | 2005-04-14

US20050079442A1

Chemistry; metallurgy

Halo resistent, photoimagable coverlay compositions, having advantageous application and removal properties, and methods relating thereto

InventorID:

4392195 ⎘