Timothy Stumpf

City:

St. Charles, Missouri

Country:

United States

Published Applications:

Last publication date:

2007-04-12

Recent patent applications by Stumpf Timothy

Timothy Stumpf from St. Charles, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Method and system for three dimensional work instructions for modification processes

Method of developing a plan for replacing a product component using a scanning process

Method and apparatus for integrating virtual environments with functional simulations via HLA protocol

InventorID:

4392360 ⎘