Boise, Idaho
United States
8
2007-04-19
The entities that hold a legal rights for patent applications filed by inventor Becker David S.:
David S. Becker from Boise, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Method of forming high aspect ratio apertures
#2 | 2007-02-27Plasma etching methods
#3 | 2007-01-16Method of forming high aspect ratio apertures
#4 | 2006-08-24Etchant and method of use
#5 | 2006-07-11Etchant and method of use
#6 | 2006-05-23Method for enhancing silicon dioxide to silicon nitride selectivity
#7 | 2005-10-25Plasma etching methods
#8 | 2005-05-10Etchant and method of use
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