Michael David Cusack

City:

Boise, Idaho

Country:

United States

Published Applications:

Last publication date:

2007-11-08

Top Assignees for applications by Michael David Cusack

The entities that hold a legal rights for patent applications filed by inventor Cusack Michael David:

Michael David Cusack from Boise, US has applied for patents for these inventions. The list has both pending applications and granted patents:

System and method for routing signals between side-by-side die in lead frame type system in a package (SIP) devices

System and method for providing a power bus in a wirebond leadframe package

System and method for routing supply voltages or other signals between side-by-side die and a lead frame for system in a package (SIP) devices

Method and apparatus for optically detecting selections made on an input device

Printer controller apparatus implemented as a system in a package

InventorID:

4394561 ⎘