Jun-Young Yang

City:

Paju-Si

Country:

South Korea

Published Applications:

Last publication date:

2007-04-19

Top Assignees for applications by Jun-Young Yang

The entities that hold a legal rights for patent applications filed by inventor Yang Jun-Young:

Jun-Young Yang from Paju-Si, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

Semiconductor package for encapsulating multiple dies and method of manufacturing the same

Singulation method used in image sensor packaging process and support for use therein

Process and lead frame for making leadless semiconductor packages

InventorID:

4395641 ⎘