Hiroki Iwase

City:

Osaka

Country:

Japan

Published Applications:

Last publication date:

2007-04-26

Top Assignees for applications by Hiroki Iwase

The entities that hold a legal rights for patent applications filed by inventor Iwase Hiroki:

Hiroki Iwase from Osaka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Device for applying foamed hot melt adhesive, and method for selectively applying foamed hot melt adhesive and solid hot melt adhesive

InventorID:

4397882 ⎘