Ming-Jer Chiu

City:

Hsinchu

Country:

Taiwan

Published Applications:

Last publication date:

2008-10-02

Top Assignees for applications by Ming-Jer Chiu

The entities that hold a legal rights for patent applications filed by inventor Chiu Ming-Jer:

Ming-Jer Chiu from Hsinchu, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

Wiring layout having differently shaped vias

Bond pad structure

Method for improving design window

InventorID:

4398111 ⎘